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Description

The NOX Thermal T1 thermal compound, supplied in a 4 g syringe, is formulated with carbon, metal oxide and silicone to facilitate heat transfer between your CPU or GPU and its heatsink. It offers a thermal conductivity of 8.3 W/m·K and a thermal resistance of 0.0014 °C/W, with an operating temperature range of -30 to 240 °C. Its non-conductive composition prevents the risk of short circuits, and its viscosity of 10000 CPS, together with a thixotropic index of 350, ensures stable and durable application. Furthermore, this compound is easy to clean, complies with CE and RoHS certifications, and its density of 3.7 g/cm³ guarantees reliable performance.

Specifications

Features


  • Thermal conductivity: 8.3 W/m·K
  • Density: 3.7 g/cm³
  • Constitutive ingredients: Carbon, Metal oxide, Silicone
  • Silicone percentage: 20%
  • Carbon percentage: 25%
  • Metal oxide percentage: 55%
  • Product colour: Grey, Yellow
  • Non-conductive: Yes
  • Viscosity note: 10000 CPS
  • Thermal resistance: 0.0014 °C/W
  • Compatible products: CPU, GPU
  • Operating temperature (T-T): -30 - 240 °C
  • Certification: CE

Technical details


  • Moment beared temperature: -50 - 280 °C
  • Thixotropic Index (TI): 350
  • Easy cleaning: Yes
  • Compliance certificates: RoHS

Weight & dimensions


  • Weight: 4 g

Packaging data


  • Quantity per pack: 1 pc(s)
  • Spatula: Yes
  • Applicator: Yes
  • Package weight: 25 g
  • Package type: Blister

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