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NOX Thermal T1 heat sink compound 8.3 W/m·K 4 g

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NOX Thermal T1 heat sink compound 8.3 W/m·K 4 g

$7.62

$7.62 without VAT

Amount

Brand: NOX

SKU: 81942 PRC: 246236 EAN: 8436532169717 PN: nxhummertt1

Description

Specifications

Features

Thermal conductivity: 8.3 W/m·K
Density: 3.7 g/cm³
Constitutive ingredients: Carbon, Metal oxide, Silicone
Silicone percentage: 20%
Carbon percentage: 25%
Metal oxide percentage: 55%
Product colour: Grey, Yellow
Non-conductive: Yes
Viscosity note: 10000 CPS
Thermal resistance: 0.0014 °C/W
Compatible products: CPU, GPU
Operating temperature (T-T): -30 - 240 °C
Certification: CE

Technical details

Moment beared temperature: -50 - 280 °C
Thixotropic Index (TI): 350
Easy cleaning: Yes
Compliance certificates: RoHS

Weight & dimensions

Weight: 4 g

Packaging data

Quantity per pack: 1 pc(s)
Spatula: Yes
Applicator: Yes
Package weight: 25 g
Package type: Blister

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