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Description

Apply Thermal Grizzly Aeronaut heat sink compound, 7.8 grams and 3 ml, to optimise thermal transfer between your processor and heatsink. This compound offers thermal conductivity of 8.5 W/m·K and a density of 2.6 g/cm³, with a silicone base that ensures stable handling. Its operating temperature range spans from -150 to 200 °C, being non-conductive for added safety during installation. Use it in your maintenance or assembly tasks for efficient thermal connection.

Specifications

Features


  • Thermal conductivity: 8.5 W/m·K
  • Density: 2.6 g/cm³
  • Constitutive ingredients: Silicone
  • Non-conductive: Yes
  • Operating temperature (T-T): -150 - 200 °C

Weight & dimensions


  • Volume: 3 ml
  • Weight: 7.8 g

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