Description
The NOX Thermal 880 thermal paste, in its 23-gram format, offers a thermal conductivity of 5.15 W/m·K to facilitate heat transfer between your CPU or GPU and the heatsink. Its non-conductive formula, composed of 45% carbon and 45% metallic oxide, ensures safe and stable application within an operating range of -30 to 280 °C. With a viscosity of 12500 CPS and a thixotropic index of 330, it maintains an optimal consistency that makes it easy to spread and prevents running, while its thermal resistance of 0.004 °C/W helps optimise cooling performance. This grey compound, with a density of 3 g/cm³, is easy to clean and complies with CE and RoHS certifications for regular use in computer builds.
Specifications
Features
- Thermal conductivity: 5.15 W/m·K
- Density: 3 g/cm³
- Constitutive ingredients: Carbon, Metal oxide, Silicone
- Silicone percentage: 10%
- Carbon percentage: 45%
- Metal oxide percentage: 45%
- Product colour: Grey
- Non-conductive: Yes
- Viscosity note: 12500 CPS
- Thermal resistance: 0.004 °C/W
- Compatible products: CPU, GPU
- Operating temperature (T-T): -30 - 280 °C
- Certification: CE
Technical details
- Moment beared temperature: -50 - 340 °C
- Thixotropic Index (TI): 330
- Easy cleaning: Yes
- Compliance certificates: RoHS
Weight & dimensions
- Weight: 23 g
Packaging data
- Quantity per pack: 1 pc(s)
- Spatula: Yes
- Applicator: Yes
- Package weight: 42 g
- Package type: Open box
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