Description
The NOX TG-1 thermal paste features a thermal conductivity of 2.5 W/m·K, designed to improve heat transfer between the processor and its heatsink. With a viscosity of 850 poise, its application is simple and uniform, maintaining a density of 3.69 g/cm³ in its characteristic grey colour. Its operating temperature range spans from -30 °C to 240 °C, allowing use in demanding conditions without compromising stability. This compound is supplied in an individual single-piece package, ready to optimise thermal contact in your system.
Specifications
Features
- Type: Thermal paste
- Thermal conductivity: 2.5 W/m·K
- Density: 3.69 g/cm³
- Product colour: Grey
- Viscosity note: 850 poise
- Operating temperature (T-T): -30 - 240 °C
Packaging data
- Quantity per pack: 1 pc(s)
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