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Description

Apply this Thermal Grizzly heat sink compound in its 37 g presentation, equivalent to 10 ml, to ensure efficient thermal transfer between the processor and the cooling block. Its thermal conductivity of 12.5 W/m·K remains stable over a wide operating temperature range of -250 to 350 °C, withstanding extreme conditions without degrading. Formulated with a silicone base and a density of 3.7 g/cm³, this product is not electrically conductive, reducing risks when contacting other motherboard components. Designed for high-performance applications, it offers a durable layer that facilitates heat dissipation in advanced cooling systems.

Specifications

Features


  • Thermal conductivity: 12.5 W/m·K
  • Density: 3.7 g/cm³
  • Constitutive ingredients: Silicone
  • Non-conductive: Yes
  • Operating temperature (T-T): -250 - 350 °C

Weight & dimensions


  • Volume: 10 ml
  • Weight: 37 g

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