Description
Apply NOX HUMMER THERMA FLOW 8 gram thermal paste to optimise heat transfer between the processor and its heat sink. Its grey compound offers a thermal conductivity of 14.6 W/m·K, with a density of 2.1 g/cm³ and a viscosity of 80-85 Pa s that facilitates uniform application. It works in an operating temperature range of -30 to 150 °C and has a thermal resistance of 0.001 °C/W for efficient heat management in your equipment.
Specifications
Features
- Type: Thermal paste
- Thermal conductivity: 14.6 W/m·K
- Density: 2.1 g/cm³
- Product colour: Grey
- Viscosity note: 80-85 Pa s
- Thermal resistance: 0.001 °C/W
- Operating temperature (T-T): -30 - 150 °C
Weight & dimensions
- Weight: 8 g
Packaging data
- Quantity per pack: 1 pc(s)
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