Thermal Grizzly Aeronaut heat sink compound 8.5 W/m·K 1 g
More info
Brand: THERMAL GRIZZLY
Stock available: 43 units.
Description
The Thermal Grizzly Aeronaut heat sink compound, in its 1 gram format, offers a thermal conductivity of 8.5 W/m·K to optimise heat transfer between the processor and the heat sink. Its silicone formulation, with a density of 2.6 g/cm³, remains stable across a wide operating temperature range from -150 to 200 °C. Being a non-conductive material, you can safely apply it to components without the risk of short circuits. This thermal paste is suitable for installing cooling systems in desktop computers.
Specifications
Features
- Thermal conductivity: 8.5 W/m·K
- Density: 2.6 g/cm³
- Constitutive ingredients: Silicone
- Non-conductive: Yes
- Operating temperature (T-T): -150 - 200 °C
Weight & dimensions
- Weight: 1 g
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