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Description

The Thermal Grizzly Aeronaut heat sink compound, in its 1 gram format, offers a thermal conductivity of 8.5 W/m·K to optimise heat transfer between the processor and the heat sink. Its silicone formulation, with a density of 2.6 g/cm³, remains stable across a wide operating temperature range from -150 to 200 °C. Being a non-conductive material, you can safely apply it to components without the risk of short circuits. This thermal paste is suitable for installing cooling systems in desktop computers.

Specifications

Features


  • Thermal conductivity: 8.5 W/m·K
  • Density: 2.6 g/cm³
  • Constitutive ingredients: Silicone
  • Non-conductive: Yes
  • Operating temperature (T-T): -150 - 200 °C

Weight & dimensions


  • Weight: 1 g

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Over 10 years of experience.

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