Thermal Grizzly Kryonaut heat sink compound Thermal paste 12.5 W/m·K 1 g
More info
Brand: THERMAL GRIZZLY
Stock available: 41 units.
Description
Thermal Grizzly Kryonaut heat sink compound in a 1 g format, with a thermal conductivity of 12.5 W/m·K and a density of 3.7 g/cm³. This heat sink compound is formulated with silicone and is non-conductive, preventing the risk of short circuits when applied to the processor. It operates within a temperature range of -250 to 350 °C, covering extreme conditions without degrading. Apply a small amount to the surface of the chip and spread it with the appropriate tool to optimise thermal transfer between the processor and the heat sink.
Specifications
Features
- Type: Thermal paste
- Thermal conductivity: 12.5 W/m·K
- Density: 3.7 g/cm³
- Constitutive ingredients: Silicone
- Non-conductive: Yes
- Operating temperature (T-T): -250 - 350 °C
Weight & dimensions
- Weight: 1 g
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