Description
Apply this white 25 g thermal paste from Phasak, reference DTA 025, to optimise heat transfer between your processor and heatsink. Its formulation offers a thermal conductivity of 0.925 W/m·K and a resistance of 0.229 °C/W, ensuring proper thermal management. It operates stably across a wide operating temperature range of -30 to 300 °C, with a viscosity of 5.1 that facilitates even application. The tub contains 25 g of product, sufficient for multiple applications on various systems.
Specifications
Features
- Type: Thermal paste
- Thermal conductivity: 0.925 W/m·K
- Product colour: Black, White
- Viscosity note: 5.1
- Thermal resistance: 0.229 °C/W
- Operating temperature (T-T): -30 - 300 °C
Weight & dimensions
- Weight: 25 g
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