Thermal Grizzly Minus Pad 8 heat sink compound 8 W/m·K
More info
Brand: THERMAL GRIZZLY
Stock available: 4 units.
Description
Thermal Grizzly Minus Pad 8, a heat sink compound in sheet form measuring 100 x 100 mm and 1 mm thick, offers thermal conductivity of 8 W/m·K to transfer heat efficiently between components. This pad, made from silicone and metal oxide, withstands operating temperatures from -100 to 250 °C, covering a wide range of applications. Its composition and RoHS certification ensure safe and regulation-compliant use. Place it between the processor and the heatsink to fill surface micro-irregularities and improve thermal contact without needing to apply additional pressure.
Specifications
Features
- Thermal conductivity: 8 W/m·K
- Constitutive ingredients: Metal oxide, Silicone
- Operating temperature (T-T): -100 - 250 °C
Technical details
- Compliance certificates: RoHS
Weight & dimensions
- Width: 100 mm
- Depth: 100 mm
- Height: 1 mm
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