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Description

Specifications

Features


  • Buffered memory type: Unregistered (unbuffered)
  • CAS latency: 11
  • Memory layout (modules x size): 1 x 8 GB
  • Internal memory type: DDR3L
  • Component for: Laptop
  • Memory form factor: 204-pin SO-DIMM
  • ECC: No
  • Memory bus: 64 bit
  • Memory voltage: 1.35, 1.5 V
  • Module configuration: 1G X 64
  • Row cycle time: 48.125 ns
  • Refresh row cycle time: 260 ns
  • Row active time: 35 ns
  • Country of origin: Taiwan
  • Lead plating: Gold

Operational conditions


  • Operating temperature (T-T): 0 - 85 °C
  • Storage temperature (T-T): -55 - 100 °C

Weight & dimensions


  • Width: 67.6 mm
  • Height: 30 mm

Logistics data


  • Harmonized System (HS) code: 84733020

Other features


  • Internal memory: 8192 MB
  • Chips organisation: X8
  • Bus clock rate: 1600 MHz
  • Error indication: No
  • Memory layout: 1 x 8192 MB

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