StarTech.com Thermal Paste, Metal Oxide Compound, Re-sealable Syringe (1.5g), CPU Heat Sink Thermal Grease Paste
More info
Brand: STARTECH.COM
6.63 €
5.67 €
without VAT
incl. 17 % VAT · Shipping to Luxembourg
Stock available: 87 units.
Get it
on the
October 7
/
October 8
SKU:
74667
PRC:
71112
EAN:
650307888476
PN:
SILVGREASE1
Description
StarTech.com thermal paste comes in a 1.5 g silver syringe, designed to improve heat transfer between the processor and the heat sink. Its compound combines silicone and metal oxide, with a thermal conductivity of 1.93 W/m·K and a thermal resistance of 0.12 °C/W. The relative density is 1.7 g/cm³ and it withstands an operating temperature range of -30 to 180 °C. It presents a bleed of 0.05% and an evaporation of 0.001%, both measured at 200 °C for 24 hours. It has RoHS certificates of compliance and dimensions of 20 mm in width by 67 mm in depth, with a weight of 4 g. Apply it to the surface of the chip before securing the heat sink to promote contact between both parts.
Specifications
Features
- Type: Thermal paste
- Thermal conductivity: 1.93 W/m·K
- Product colour: Silver
- Thermal resistance: 0.12 °C/W
- Specific gravity: 1.7 g/cm³
- Operating temperature (T-T): -30 - 180 °C
Technical details
- Evaporation (@ 200°C/24h): 0.001%
- Bleed (@ 200°C/24h): 0.05%
- Compliance certificates: RoHS
Weight & dimensions
- Width: 20 mm
- Depth: 67 mm
- Weight: 4 g
Packaging data
- Package width: 84 mm
- Package depth: 151 mm
- Package height: 25 mm
- Package weight: 17 g
Logistics data
- Master (outer) case width: 330 mm
- Master (outer) case length: 430 mm
- Master (outer) case height: 330 mm
- Products per master (outer) case: 230 pc(s)
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