Description
The COOLBOX H70 thermal paste is a grey heat sink compound applied between the processor and the heat sink to improve heat transfer. Its thermal conductivity of 3.17 W/m·K allows stable performance across a wide variety of configurations. It withstands an operating temperature range of -30 to 240 °C, making it suitable for both equipment working in cold conditions and demanding heat conditions. Its thermal resistance of 0.0067 °C/W indicates low opposition to heat flow, which favours efficient dissipation. With a weight of 2 g, it comes in a compact format that is easy to apply to the chip surface. The formula is certified with Eco-raee and CE, which supports its use in computer equipment. This compound is a practical option for keeping temperatures under control in towers, laptops and custom systems.
Specifications
Features
- Thermal conductivity: 3.17 W/m·K
- Product colour: Grey
- Thermal resistance: 0.0067 °C/W
- Operating temperature (T-T): -30 - 240 °C
- Certification: Eco-raee,CE
Weight & dimensions
- Weight: 2 g
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