Description
The ABYSM A2 thermal paste is a grey heat sink compound applied between the processor and the heat sink to improve temperature transfer. It offers a thermal conductivity of 5 W/m·K, suitable for assemblies that need to dissipate heat efficiently. Its relative density is 2.6 g/cm³ and it withstands an operating temperature range of -50 to 240 °C, so it maintains its properties both in cold environments and in equipment subjected to intense heat. The format includes an applicator that makes dosing onto the chip surface easier. The content has a volume of 2.6 ml and a weight of 4 g, enough for several applications. Its grey colour makes the covered area clearly visible during installation. It is a paste indicated for those who build or upgrade their equipment and are looking for a reliable thermal compound.
Specifications
Features
- Thermal conductivity: 5 W/m·K
- Product colour: Grey
- Specific gravity: 2.6 g/cm³
- Operating temperature (T-T): -50 - 240 °C
Weight & dimensions
- Volume: 2.6 ml
- Weight: 4 g
Packaging data
- Quantity per pack: 1 pc(s)
- Applicator: Yes
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