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Description

Apply this NOX HUMMER THERMA PRO thermal paste to the processor to optimise heat transfer between the chip and the heatsink. With a thermal conductivity of 17.3 W/m·K and a resistance of 0.0006 °C/W, its grey formula with a viscosity of 130–140 Pa s spreads easily. It operates at temperatures between -20 and 130 °C, maintaining a density of 2.7 g/cm³ in its 4-gram presentation. This product from the heatsink category ensures precise application for desktop builds.

Specifications

Features


  • Type: Thermal paste
  • Thermal conductivity: 17.3 W/m·K
  • Density: 2.7 g/cm³
  • Product colour: Grey
  • Viscosity note: 130-140 Pa s
  • Thermal resistance: 0.0006 °C/W
  • Operating temperature (T-T): -20 - 130 °C

Weight & dimensions


  • Weight: 4 g

Packaging data


  • Quantity per pack: 1 pc(s)

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